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Definition :

Support of lapping and polishing plane and circular, its diameter can go from 150mm to 2000mm. The plate is put in rotation on a polishing machine or lapping machine. The combination “plate of grinding + diamond liquid” creates an abrasion. The action of abrasion is made from the rotation of the plate, under the effect of the initial weight of the parts and of the load applied by the jacks of the machine (in the case of a grinding machine equipped with a pneumatic system), the diamond grains move and are fixed by producing an abrasive action only on the face of the parts to be ground.

LAM PLAN develops and patents its own lapping and polishing plates: NEW LAM® M’M’® plates. The patent: an alternation between an effect of “cut” and an effect of shock ensured by the various hardness of the both component of the plate, formed by the regular geometrical drawings on its surface. The homogeneous distribution of the hard components of the plates contributes o obtaining a perfect flatness by rolling of abrasive film.

 

 

 

ISO 9001
LAM PLAN SA - Polishing Technology | 7, rue des Jardins B.P.15 74240 Gaillard | Tél. : +33 (0)4 50 43 96 30 | Fax : +33 (0)4 50 87 01 60 | E-mail : mmsystem@lamplan.fr