Lapping

A fundamental element of lapping is the use of abrasives in a chemical environment (carrier), liquid or paste, to keep the abrasive particles free. This abrasive carrier is injected between the part and the lapping plate.

The " free abrasive " lapping process allows you to obtain two decisive criteria for the machined parts:

• The surface finish of the machined face is produced, precisely and constantly.
• An extreme flatness, the geometry of the part is directly governed by the geometry of the lapping plate.

To guarantee the 2 roughness and flatness criteria:

• According to the part to be machined, you have a choice of abrasive, abrasive carrier and lapping plate.
• The part must not be exposed to any thermal or mechanical tensions during the machining.

A large range of abrasives:

	Bio DIAMANT® liquids Bio DIAMANT® pastes Bio DIAMANT® sticks NEW LAM® M’M’ bi-component plates Mono-component plates Série 2000 LAM PLAN polishing discs
	Composite abrasives (colloidal silica, Al2O3, SiC, B4C, CeO2) Abrasives pastes ( Al2O3, SiC, B4C, CeO2) Abrasive powders ( Al2O3, SiC, B4C, CeO2) Powders( Al2O3, SiC, B4C, CeO2) Jets ( Al2O3, SiC, B4C, CeO2) Cast Iron rings AQUA LAM polishing pads